FCB2012 SERIES-ZG Tianxin

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FCB2012 SERIES

Chip Common Mode Inductor

Low profile, small volume.
High consistency, high welding reliability.
Excellent EMI suppression.
Surface mounting technology.
Operating temperature range: -40°C~+105°C, self-temperature rise included.
Ideal for Multimedia System , LVDS and USB.

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Datasheet

3D Model

Product specifications

P/N	Impedance 1-4=2-3		DCR(Ω,Max.) 1-4=2-3	Insulation Resistance(MΩ,Min.) 1-4=2-3	Rated Current(mA,Max.)	Rated Voltage(V,Max.)
P/N	Ω,Min.	Ω,Typ.	DCR(Ω,Max.) 1-4=2-3	Insulation Resistance(MΩ,Min.) 1-4=2-3	Rated Current(mA,Max.)	Rated Voltage(V,Max.)

P/N	Impedance 1-4=2-3		DCR(Ω,Max.) 1-4=2-3	Insulation Resistance(MΩ,Min.) 1-4=2-3	Rated Current(mA,Max.)	Rated Voltage(V,Max.)
P/N	Ω,Min.	Ω,Typ.	DCR(Ω,Max.) 1-4=2-3	Insulation Resistance(MΩ,Min.) 1-4=2-3	Rated Current(mA,Max.)	Rated Voltage(V,Max.)
FCB2012-900Z	65	90	0.19	10	400	50
FCB2012-900ZA	65	90	0.3	10	300	50
FCB2012-121Z	90	120	0.22	10	370	50
FCB2012-201Z	150	200	0.25	10	350	50
FCB2012-361Z	270	360	0.5	10	220	50
FCB2012-681Z	510	680	1.3	10	200	50
FCB2012-102Z	750	1000	1.5	10	190	50
FCB2012-222Z	1500	2200	2.5	10	150	50

NOTES:

1. All electrical specifications are referenced to 25°C± 5°C ambient.

2. The impedance is measured at 100 MHz, 0.1 Vrms, 0 ADC.

3. The temperature of the component (ambient plus temperature rise) must be within the stated operating temperature range.

4. The rated current means DC current at 25°C that causes an temperature rise of 40°C approx.

Temperature rise is highly dependent on many factors including PCB land pattern, trace size, and proximity to other components.

Therefore temperature rise should be verified in application conditions.

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